Jungo kicks off 2009 by announcing Gennum partnership


Dear Developer,

The Jungo Connectivity Software News keeps you updated with information on driver development, embedded USB software stacks and cutting-edge USB testing tools.

In this issue:
Instant Downloads: WinDriver Trial, DriverCore White-papers, USBware White-papers, and additional Product Resources.

Jungo-Gennum Partnership
Gennum adopts Jungo's WinDriver PCI Express® driver toolkit to accelerate PCIe endpoint development. Jungo Ltd. has announced that Gennum Corporation (TSX: GND), a top-tier semiconductor solution and IP core provider, will bundle Jungo's WinDriver PCI Express® driver development toolkit with its GN4124, the industry's first x4 PCI Express (PCIe) to local bus endpoint bridge chip.

The highlights of the joint offering are:
  • Gennum endpoint bridge together with Jungo's WinDriver PCI Express® driver toolkit provide low-cost, turnkey PCIe solution
  • Solution accelerates time to market for operators
  • Support for commonly used security algorithms
  • Integrated solution delivers four lanes at 2.5Gb/s or 10Gb/s in each direction
For more information see: press release
Jungo at CES 2009
At CES, Jungo will showcase its embedded USB 2.0 and 3.0 Host/Device/On-the-Go/Wireless protocol stacks.

The show will take place on January 8-11, 2009 at the Las Vegas Convention Center:
Jungo will be in the USBTech zone, South Hall 3, upper level - booth# 30368.

We look forward to welcoming our numerous customers and ecosystem partners there, and will be visiting other booths to spread the word.
For more details on CES 2009 please visit: CES 2009

In addition to presenting at CES, as a Tier-1 software supplier in the Automotive market, Jungo will have a delegation in the Telematics conference preceding the CES show.
For more details on Consumer Telematics Seminar 2009 please visit: Consumer Telematics Seminar 2009

Jungo Extends USBWare Support to USB 3.0
USB 3.0, also known as SuperSpeed USB, is the new standard USB protocol. It boasts several benefits over the current "High Speed" USB 2.0 protocol:

  • Bandwidth of up to 5.0 Gb/s (compared to 480 Mb/s in USB 2.0)
  • Faster identification of devices
  • Improved power efficiency and management
  • Increased power supply capability to devices
  • Optical as well as traditional USB-wired interconnection


The new standard is physically and functionally backwards compatible with USB 2.0 and can support devices complying with older specifications.

For more information see: USB 3.0
DriverCore Raises the Bar on USB Driver Development
Thanks to its overwhelming ubiquity, USB is becoming a transport layer for higher functionality that exposes various connectivity types to the host operating system. The UBS Implementers Forum (USB-IF) have defined several such standardized USB classes: Serial-over-USB, Ethernet-over-USB, OBEX-over-USB, Device Firmware Upgrade class driver (DFU), and others. Jungo's DriverCore offers high performance host PC USB class drivers with full support for any standard host operating system.

Jungo is offering a new white paper for manufacturers of devices requiring higher functionality over USB. The document quantifies the steps in USB class driver development, and details the alternative approaches for their implementation. It goes on to weigh the relative benefits of each approach. Finally, it brings some general use cases for extremely demanding markets, such as: military, medical and mobile.

For more information see: DriverCore™
Jungo Releases New USBware ICCD Class Driver
ICCD—intended for next-generation SIM cards and USB inter-chip connectivity—simplifies integration of multiple high speed capabilities, and meets the increasing bandwidth needs of devices like: 3G/4G modems, WiMAX, 802.11n and storage peripherals, as well as other USB-based input devices like keypads and control panels.

The IC-USB permits data transfer at higher bandwidth and with improved power efficiency. It also provides a digital signal interconnect between the systems on chip (SOC) and their IC peripherals, eliminating the need for analog PHYs.

Jungo's USBware ICCD Stack is tested with leading manufacturers of high density SIMs, which complies with the following specifications:
  • IC-USB V 1.0
  • European Telecommunications Standards Institute (ETSI) - ETSI TS 102 600 V7.1.0
For more information see: ICCD